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REALTIME NEWS
STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips
Semiconductors
1min ago
Oct 30, 12:04
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
Oct 30, 12:25
Analysis: Japan's new PM aims to replicate TSMC playbook with tech investment push
Oct 30, 11:21
GlobalFoundries to invest EUR1.1 billion to expand Dresden semiconductor facility
Oct 30, 11:17
Samsung 3Q25 profit surges on AI chip demand, beats estimates
Oct 30, 10:22
Jensen Huang kills three birds with one stone at GTC DC
LATEST STORIES
7 days news
'Semiconductor paradox' defines next chip boom, says director of Singapore's SSIA
Oct 30, 12:35
SEMICONDUCTORS
TPSC unveils Taiwan's largest perovskite solar window
Oct 30, 12:16
SUSTAINABILITY
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Oct 30, 12:16
EAST ASIA
Microsoft's AI engine accelerates with record growth and expanding partnerships
Oct 30, 12:13
ICT
Wingtech urges the Netherlands to reverse takeover of Nexperia through Dutch public media
AMD completes divestiture of ZT Systems manufacturing business to Sanmina
China's 15th Five-Year tech doctrine to tilt global industry balance
Commentary: China's JCET bets on AI to challenge global packaging giants
Palantir integrates Nvidia AI chips to enhance operational decision-making
Meta posts strong quarter, but rising AI spend signals tougher road ahead
Lite-On projects double growth in 4Q25, eyes full-year rebound
Celestica delivers record third-quarter results on strong AI infrastructure demand, raises full-year outlook
OpenAI to offer free one-year ChatGPT Go subscription in India
Solar supplier Motech targets high-margin niches with differentiated technology
Flex posts record quarter as it pivots toward higher-margin, AI-focused business
Liquid cooling adoption in ASIC servers is expected to rise significantly by 2026
JCET unveils Singapore blueprint for next-gen semiconductor packaging
Delta Electronics to acquire majority stake in Japanese RF power systems firm Noda RF Technologies
Meta’s headset slump clouds short term, but AI glasses point to brighter future
Zuckerberg outlines Meta’s AI endgame—superintelligence at global scale
Pichai outlines Alphabet’s next act: scaling AI from cloud to cars
Google’s record quarter fuels an infrastructure binge for the AI age
Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day
Shinkong InnovHub launch to boost Taiwan's drone and tech industries
Texas Instruments sees 50% YoY data center growth amid signs of slower recovery
Nexperia's export ban sparks Brazil auto shutdown fears
A hundred years of quantum physics — and Taiwan wants in
Wistron, Nvidia bring digital twin manufacturing to the US AI supply chain
Glass substrates edge toward prime time in PCB and chip packaging sector
Pegatron eyes 1Q26 production launch for Texas plant with Nvidia GB300 servers
BIZ FOCUS
Oct 2, 10:32
SK Group partners with OpenAI to advance global AI infrastructure
Thursday 23 October 2025
APD: Technology-Driven Innovation Powering Global Growth
Thursday 23 October 2025
Rising Bitcoin Swings Signal Shifting Priorities For Global Tech Markets
Thursday 23 October 2025
Femtometrix Honored by the World's Leading Memory Manufacturer, for Pioneering Optical Process Control Technologies
MOST-READ
How a viral Taiwan dinner photo put Nvidia and its partners under Washington’s microscope
Samsung launches aggressive price-cut strategy to catch up in HBM competition
Broadcom and Marvell land major AI accelerator orders, TSMC remains key manufacturer
Netherlands seizes control of Nexperia, deepening Europe-China tech rift
Micron warns DRAM market tightness to worsen through 2026
Memory shortage hits 70% order fulfillment; server DRAM prices surge 50%
CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
MULTIMEDIA
Inside Korea’s CES: Flying Cars and Robots Are Here!
Dutch government seizes Nexperia
The Dutch government has seized the assets of Nexperia, a core subsidiary of Chinese tech giant Wingtech, citing national security concerns.
Nexperia crisis threatens disruption to EU and US auto production
Nexperia's turmoil opens door for Taiwan's Panjit in EU auto market
Dutch Minister held call with Beijing in rising tensions over Nexperia asset freeze
...More
EV
Friday 3 October 2025
LGES to resume US business trips after visa rules clarified by South Korea-US group
BYD reignites price war after smart driving campaign fails to spark demand
Wednesday 29 October 2025
Unified packaging standards seen as key to meeting AI and automotive demands
Wednesday 29 October 2025
Foxconn expands US AI server buildout, joins Nvidia-Stellantis-Uber robotaxi effort
Wednesday 29 October 2025
TECH
Friday 3 October 2025
Apple eyes Taiwan for foldable iPhone trials amid supply chain shifts
Samsung reorganizes memory line by accelerating HBM4 production at P4 plant
Wednesday 29 October 2025
Innodisk teams with Intel and Qualcomm to boost AI revenue by 30% in 2026
Friday 17 October 2025
TSMC in Intel’s investment talks, as Andrew Ng flags Taiwan risk
Friday 26 September 2025
ASIA
Tuesday 7 October 2025
NTT to launch next-gen IOWN optical network infrastructure in 2026
BYD reignites price war after smart driving campaign fails to spark demand
Wednesday 29 October 2025
South Korean tycoons meet Nvidia CEO as part of APEC corporate diplomacy
Wednesday 29 October 2025
SK Hynix unveils new NAND line featuring HBF for AI
Wednesday 29 October 2025
OPINIONS
Friday 3 October 2025
Commentary: UMC's steep price cuts could backfire, driving suppliers to advanced nodes
Column: How China's rare earth chokehold is reshaping the global tech landscape
Wednesday 29 October 2025
Commentary: Lessons from Arm China and Nexperia’s unraveling
Wednesday 29 October 2025
Column: Niche markets and circular economy drive Taiwan battery industry's new growth strategy
Wednesday 29 October 2025
TOPICS
TSMC UPDATES
GEOWATCH
EMS WATCH
PERC SOLAR CELLS
SPECIAL REPORTS
Wednesday 29 October 2025
Chiplet and advanced packaging for AI chips
Advanced packaging will drive AI chip performance upgrades, with new routes emerging in both materials and packaging architectures.
Thursday 23 October 2025
Global top-3 memory maker status, 3Q25
SK Hynix’s oligopolistic advantage in HBM had diminished in the third quarter of 2025, and memory competition will expand from HBM to next-generation products.
Tuesday 21 October 2025
China smartphone industry, 3Q 2025
Chinese smartphone shipments reached 177 million units in the third quarter of 2025, and shipments are expected to increase by 7.5% quarter-on-quarter in the fourth quarter.
Friday 17 October 2025
FOPLP tech development
The AI chip market holds tremendous potential - breakthroughs in FOPLP technology to overcome the RDL-first process barrier will be the key to success.
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